Case Study: Localized Thickness Monitoring

Our Direct-Write (DW) ultrasonic transducer array, consisting of seven elements, was fabricated onto an aluminum-alloy test block to provide thickness monitoring. Each direct-write ultrasonic transducer conducts active mode pulse-echo ultrasonic testing, generating and detecting bulk waves sequentially. 

When a bulk wave reflects off the backwall of the structure, the time taken for reflection reveals any changes in thickness directly beneath the direct-write ultrasonic transducer. A decrease in reflection time indicates a reduction in thickness, enabling thickness monitoring.

This low-profile array can be seamlessly integrated onto the host structure and covered by a paint layer, remaining virtually invisible without compromising aesthetics. It blends with the structure, appearing as though no ultrasonic transducer is present on the surface.

Ultrasonic SHM System

A compact ultrasonic SHM system can be integrated with the direct write ultrasonic transducer array, offering customization options for user-specified connectors. The system wirelessly transmits ultrasonic signals to a computer for post-processing and analysis. 

Software Interface

The user-friendly, interactive dashboard allows for real-time analysis, monitoring thickness changes, and ensuring ongoing structural health.

Performance of the current setup